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Presidente de Sessão: Cesar Fontana/UDESC
Palestra 13
Techniques beyond 2D imaging: getting the full story beneath the surface from your materials
Daniel Phifer (FEI Company)
http://www.fei.com
Abstract:
Join us for an exclusive tutorial where we will discuss new techniques for easily characterizing increasingly complex materials, and visualizing materials beyond 2D imaging using our Versa 3D™ DualBeam™ (SEM/FIB).
During the vendor tutorial, you'll learn about:
Easy techniques to achieve crisp imaging of the surface or below, even on non-conductive or magnetic materials Revealing subsurface features using focused ion milling, allowing you to identify underlying material structure & composition - digging deeper and revealing the third dimension Best practice techniques for preparing perfect site-specific, atomic resolution TEM samples. Better samples allow you to conduct deeper analysis and fully understand a material defect, feature or interface. Our new Versa 3D DualBeam expands your research capabilities and gives you new technique capabilities to produce better research results with complex materials.
Palestra dia 07/11 das 15:15h às 15:45h sala 2
